H30-6-1 solvent-free epoxy adhesive formula

Component dosage /g component dosage /g
E-51 epoxy resin 100 595# curing agent 2%-3%
Adipic Epoxy Resin 100   
Preparation and curing   Weigh by the amount of mixed preparation. Curing at 130 °C for 1 h .
use   This glue is used for impregnated sealing insulation of motor winding coils.

H30-6-1, solvent-free, epoxy adhesive, formulation