Lamb wave method for determining interface bonding strength of layered planar structure

Deng Mingxi

(Basic Department of Logistics Engineering College, Chongqing 400016)

Abstract: An obliquely split ultrasonic transducer placed on the surface of a layered planar structure is used to excite and receive multimode Lamb waves. The article first analyzes the feasibility of using the amplitude-frequency characteristics of multimode Lamb waves to characterize the interface bonding strength. Based on the Ritec-SNAP ultrasonic measurement system, an experimental system for determining the bonding strength of the layered structure interface using the Lamb wave method was established. For a given layered planar structure, the curing process of the adhesive layer is used to simulate the change process of the interface strength of the adhesive layer. For different bonding layer curing time, the experimentally measured multimode Lamb wave amplitude-frequency curve is obviously different. With the help of the stress wave factor in acoustic-ultrasonic technology, the definition of Lamb wave stress wave factor is given. The experimental results show that there is a definite monotone correspondence between the Lamb wave stress wave factor and the curing time that indirectly represents the bonding strength of the interface, indicating that the multimode Lamb wave stress wave factor is used to characterize the interface of the layered planar structure Adhesive strength is feasible.

Keywords: adhesive layer; interface strength; Lamb wave; stress wave

CLC number: Document identification code: A

Characterization of interface strength of adhesive joints of layered planar structures using a Lamb wave approach

DENG Ming-xi

Department of Foundation Studies, Logistics Engineering University,

Chongqing 400016, China

Abstract Wedge transducers located on the surfaces of layered planar structures are used to generate and detect the multimode Lamb waves. The feasibility of using amplitude-frequency relationships of the multimode Lamb waves to characterize the interface strength of adhesive joints of layered planar structures has been analyzed . Based on the Ritec-SNAP ultrasonic measurement system, the experimental setup for characterizing the interface strength of adhesive joints using a Lamb wave approach has been established. For a given layered planar structure, we use the solidifying process of the adhesive layer to simulate the change process of interface strength of the adhesive joint. For the different solidifying time of the adhesive layer, the measured amplitude-frequency relationships of the multimode Lamb waves are quite different. The Stress Wave Factor (SWF) in acousto-ultrasonic technique is used for reference, and the definition of the SWF of Lamb waves is given. The experimental result s show that there is a monotonic relationship between the SWF of Lamb waves and the solidifying time of the adhesive layer, and that the SWF values ​​are quite different for the different solidifying time. It can be concluded that the SWF of the multimode Lamb waves can be used to characterize the interface strength of adhesive joints of layered planar structures.

Keywords adhesive joints; interface strength; Lamb waves; stress wave factor

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