Study on Acoustic-Ultrasound Evaluation of Interface Bond Strength of Composite Structure
Deng Mingxi *
(College of Logistics Engineering, 400016, Chongqing)
Abstract Based on the Ritec-SNAP measurement system, an acoustic-ultrasonic technology experimental system was established, and the feasibility of using the amplitude-frequency characteristics of acoustic signals and stress wave factors to characterize the bonding strength of composite structures during the evaluation of acoustic-ultrasonic technology was analyzed. The curing process of the bonding layer is used to simulate the change process of the bonding strength of the composite bonding board, and the curing time of the bonding layer is used as an indirect characterization parameter of the bonding strength, and the bonding strength of the composite structure is evaluated by the established experimental system The problem was studied experimentally. The experimental results show that the stress wave factor has a monotonous corresponding relationship with the curing time of the bonding layer reflecting the interface bonding strength, and the stress wave factor at different curing periods has obvious distinguishing characteristics, indicating that the stress wave factor is used to evaluate the interface bonding of the composite structure Strength is feasible.
Keywords composite structure, bond strength, acoustic-ultrasonic technology, stress wave factor
Nondestructive evaluation of adhesive strength of composite structures using an acousto-ultrasonic approach
Deng Mingxi
(Logistics Engineering University, 400016, Chongqing)
Abstract On the basis of Ritec-SNAP measurement system, the experimental set-up using an acousto-ultrasonic approach has been established. This paper analyzes the feasibility of using the amplitude-frequency relations of the ultrasonic signals and the stress wave factor (SWF) to characterize the adhesive strength of composite structures. The solidifying process of adhesive layer has been used to simulate the change process of adhesive strength of composite structures. The adhesive strength, represented by the solidifying time of adhesive layer, of the joint layer has been experimentally studied with the established set-up. The experimental results show that there is a monotony relation between the SWF and the solidifying time of adhesive layer, and that the SWF value is quite different in different solidifying period. It is concluded that the SWF may be used to evaluate the adhesive strength of composite structures.
Key words Composite structure, Adhesive strength, Acousto-ultrasonic approach, Stress wave factor
1 Introduction
In practical applications, the composite bonding structure is widely involved. The accurate evaluation of the interface bonding strength directly affects the effective use of the composite structure. Adhesive strength refers to the maximum destructive force per unit area, which mainly depends on the cohesive strength and interface adhesion strength of the adhesive layer [1]. The ultrasonic method cannot be used to directly measure the bonding strength, but physical parameters such as the elastic modulus, sound attenuation, and layer thickness of the bonding layer can be measured. The measurement can indirectly reflect the bonding strength of the interface.
Generally speaking, the factors that affect the bonding strength of the interface are very complex, and the thickness and elastic mechanical properties of the bonding layer can affect it. Acoustic-ultrasound (AU) technology proposed by Vary et al. [2-4] as an inspection method has important application value in the evaluation and inspection of interface bonding quality [5,6]. This paper intends to use acoustic-ultrasonic technology to conduct an experimental study on the evaluation of the bonding strength of aluminum plate-adhesive layer-aluminum plate. If the correspondence between the bonding strength and SWF can be determined, the corresponding bonding strength can be known by measuring SWF, so as to achieve the purpose of non-destructive evaluation of the bonding strength of the composite structure using SWF as the evaluation parameter.
During the experiment, the curing process of the bonding layer was used to simulate the change process of the bonding strength of the composite structure. After bonding the board with an adhesive and curing the bonding structure (the relative position of the board remains fixed), there is a monotonous correspondence between the bonding strength and the curing time of the bonding layer. The bonding strength varies with the curing time. Increase and gradually increase and tend to a saturation value (highest intensity) [7]. In order to facilitate the experimental investigation of the correspondence between the bonding strength and SWF, after the composite bonding structure is cured and positioned, the curing time of the bonding layer is used as an indirect parameter to characterize the bonding strength. Under this circumstance, studying the corresponding relationship between the bonding strength and SWF becomes studying the corresponding relationship between the curing time of the adhesive layer and SWF.
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