Aluminum Cubic Foil Bag for IC or Chips Packing

Model NO.: PB-AL
Bag Variety: Upright Bag
Printing: Blank or Customized
4 Layers: Pet/Al/Ny/PE
Thickness: O.14mm
Puncture Resistance: >100n
Peel Strength: >3.0n/ 15mm
Trademark: TOPCOD/OEM
Transport Package: Carton
Specification: 22X25CM
Origin: Foshan China
HS Code: 3923210000
Description 
Aluminum foil bag ( Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag,vacuum bag,shielding bag etc) is laminated with four single layers, PET/AL/NY/PE.
It has good moisture barrier and light isolation properties. 
We have our own dry lamination plant and can customize material structure according to users' specific packing purpose.
ESD Aluminum foil bag is widely used in vacuum packing of static sensitive electronic components such as PCB, WAFER, CHIPS, REELs in SMT industry etc. For chemical raw material and medical intermediate packing, it is undoubtedly a very good choice. Various bag shapes can be produced such as open-end bag, zip-lock bag, upright bag,organ bag and so on.


Aluminum Cubic Foil Bag for IC or Chips Packing

Description
  Physical Property       Material Parameters 140±10μm
Lay 1 (Surface) Polyester (PET) 12μm
Lay 2 Aluminum foil (AL) 7μm
Lay 3 Nylon (NY) 15μm
Lay 4 (Base) Polyethylene (PE) 100μm
 
Item Name Aluminum Foil Bag for IC or Chips Packing
Product Size Customized
Shape Upright bag,organ bag, back seal bag
Printing Blank or Customized
Packaging Carton Packaging
Structure PET/AL/NY/PE (Surface-Base)
Thickness > 0.14 mm
Seal Strength > 30N/ 15mm
Peel Strength >3.0N/ 15mm
Puncture Resistance >100N
Vapor Transmission 0.002mg/100 in2 /24h
Tensile Strength  Vertical >75N/ 15mm
Horizontal >85N/ 15mm
Heat-seal Condition Temperature: 300-400F
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI
Antistatic Performance 1x105Ω< Outer surface<1x109Ω
1x105Ω< Inter surface<1x1011Ω
Metal layer<1x100Ω

Range of application
PC board,Electronic component modem,CD-driver,IC integrated circuit,hardisk,electronic equipt
ment,sophisticated hardware,auto parts,etc

Aluminum Cubic Foil Bag for IC or Chips Packing

Large scale aluminum foil bag
Aluminum Cubic Foil Bag for IC or Chips Packing

Product standard
GB/T1037-1988, GB/T1038-2000, MIL-B-81705-C, IPC/JEDEC J-STD-033B, MIL-STD-2073-1,
ASTM F1249-2005, GB/T 10004-1998, MIL-B-81705-C

Company Display
1: Established in 2002 with 14 years' experiences in this industry.
2: Combines R&D, production and sale together.
3: Owns 
advanced mechanized production line 
4: Product range: kinds of desiccants, humidity indicator card, Aluminum foil bag and other packing material.


Aluminum Cubic Foil Bag for IC or Chips Packing
Aluminum Cubic Foil Bag for IC or Chips Packing


FAQ
Q1: Can I have samples first before placing orders?
A1: Yes, we can offer you free samples and welcome your trial order.
 
Q2: When can I have the sample? How about the mass order?
A2: Usually the delivery of sample is 3-5 working days, and 15-20 days for the mass order.
 
Q3: Can you accept to print our own logo or brand on your products?
A3: Yes, customized style are welcomed here.


Q4:What is the packaging ?
A4:Carton packaging, the dimension is up to the product size.

Other product range:
Industrial desiccant (silica gel desiccant / montmorillonite desiccant / activated clay desiccant);
Food & pharmaceutical grade desiccant;
Deoxidizer (Oxygen scravenger/absorber);
Activated carbon deodorant;
Humidity Indicator Card (HIC);
Est aluminum foil  bag / Vacuum bag / VCI bag / rust proof bag (film);


Hotselling products
Aluminum Cubic Foil Bag for IC or Chips Packing

Contact info:
Miss Vanilla
Mobile: +86 13674001681 
 

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