Component dosage /g component dosage /g
Addition products of A , epoxy resin and monoethanolamine (molecular weight 870 ) 21.3 B , epoxy resin 50
Addition of epoxy resin and diethyltriamine 35.9 Hardener solution 50
Butanol 8.6 xylene 80
Xylene 34.2 butanol 20
Preparation and curing  Mixing component A can produce epoxy resin hardener solution, and then mix with B component mixture to obtain adhesive, curing at 25 ° C. for 24 hours .
use  The adhesive can be cured at room temperature without irritating odor, has good heat resistance and moisture resistance, and is used for the bonding of building structural materials.